发明名称 VACUUM MEASUREMENT APPARATUS AND VACUUM MEASUREMENT METHOD USING THE SAME
摘要 PURPOSE: A vacuum measurement apparatus and vacuum measurement method using the same is provided to prevent defects caused due to the lowered level of vacuum, by accurately measuring vacuum adsorption capability of semiconductor equipment. CONSTITUTION: A vacuum measurement apparatus comprises a main body(32) having a plurality of vacuum exhaust holes(32a) formed at the bottom surface of the main body in such a manner that the vacuum exhaust holes correspond to a plurality of vacuum adsorption holes(30a) formed at an adsorption portion(30) for adsorbing a rear surface of wafer, wherein the main body has a cavity(32c) communicated to the vacuum exhaust holes; and a vacuum system(34) attached to the outer periphery of the main body, and which measures level of the vacuum in the cavity communicated to the vacuum exhaust holes. A vacuum sealing agent(32b) is attached to the bottom surface where the vacuum exhaust holes are formed.
申请公布号 KR20020073722(A) 申请公布日期 2002.09.28
申请号 KR20010013477 申请日期 2001.03.15
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, CHAE OK
分类号 G01L21/00;(IPC1-7):G01L21/00 主分类号 G01L21/00
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