STACKED VERTICAL IN-LINE PACKAGE

摘要

PURPOSE: A stacked vertical in-line package is provided to overcome limitation of the number of unit packages and include the unit packages of the same structure regardless of the stacked number of the unit packages. CONSTITUTION: A stacked vertical in-line package(200) is formed by erecting vertically sides of unit packages(110) of the same structure as a TSOP(Thin Small Outline Package) toward a substrate(170). A base package(100a), an ending package(110b), and a middle package(100c) inserted between the base package(100a) and the ending package(110b) are arranged on the substrate(170). Each unit package(110) includes a body(150) having a semiconductor chip and the first and the second projected terminal(132,134) to the first and the second side of the body(150). A chip selection terminal(136) is mounted on the substrate(170).