| 摘要 |
PROBLEM TO BE SOLVED: To provide a downsized united structure of a high frequency component and a high frequency transmission line conversion circuit. SOLUTION: A waveguide section 5 is formed to a waveguide block 3 and a back short section 6 is formed to a cover 4. Then the waveguide block 3 and the cover 4 clamp and fix a dielectric board 1. A space 13 with a size able to contain a high frequency component 2 is formed to the cover 4, and the waveguide block 3 and the cover 4 cover the high frequency component 2. The high frequency component 2 is directly in contact with the waveguide block 3. Furthermore, a board ground 10 is formed to the board 1, a board ground 11 is formed to the high frequency component 2 and the grounds are in contact with the cover 4 and the waveguide block 3 to share the board ground and the circuit ground in common.
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