| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for attaching terminal plate member to electronic component, with which it is not necessary to care of the delay of local cooling caused by the heat capacity of a pressing member, so much in a cooling process after melting of solder. SOLUTION: When achieving soldering of a terminal electrode 2 and a terminal plate member 8 by melting a creame solder 11, while pressing the terminal plate member 8 toward the terminal electrode 2 by a pressing plane of a pressing member 16, the area of the pressing plate 17 is made smaller than that of a soldering portion. Thus, the delay of cooling caused by the heat capacity of the pressing member 17 and the deposition of a low fusing point alloy phase 15 caused by that delay occur only in the limited part.
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