| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method and a device which are improved in heating efficiency, have an improved heat transfer coefficient, and therefore are capable of keeping a heated object uniform in temperature distribution through its surface. SOLUTION: This soldering device 10A is equipped with a gas supplying source 20, a gas heating unit 12 which heats gas (e.g. air) up to a prescribed temperature, a heating oven 13 into which a board P as a work mounted with parts through the intermediary of cream solder is introduced and kept horizontal in position at a prescribed position, a gas-flow straightening unit 11 which supplies a hot blast Fa which is heated up to a prescribed temperature and flows rectilinearly at a prescribed speed in parallel with the surface of the heated surface of the board P as a work to the heating oven 13, and a control unit 15 which controls the temperature, speed, and flow rate of the hot blast Fa.
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