| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus in which heat dissipation efficiency can be increased furthermore as compared with a case where heat is dissipated through the housing. SOLUTION: The electronic apparatus 10 comprises a part 90 for dissipating heat in a housing 12 to the outside wherein the heat dissipating part 90 comprises thermal conduction members 60, 62 and 68 disposed tightly in the housing 12, and an external thermal conduction member 76 disposed on the outside of the housing 12 while being coupled thermally with the thermal conduction members 60, 62 and 68.
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