发明名称 ACTIVE PACKAGE FOR INTEGRATED CIRCUIT
摘要 An active package for an integrated circuit may include an integrated circuit and an active component that is part of the circuit topology for the integrated circuit. The active component forms at least a portion of the housing for the integrated circuit. The integrated circuit may be housed in a shell formed by one or more discrete components. The active package may be formed in the same geometry and dimensions as a standard passive integrated circuit package, or may be formed in a shape to fit inside a standard or specially made battery package, or for another special application. A smart component may include a discrete component or a semiconductor-based resistor, capacitor or inductor, and a separate integrated circuit housed in the same housing as the discrete component or a semiconductor-based resistor, capacitor or inductor. The integrated circuit may control at least one electrical parameter of the discrete component or a semiconductor-based resistor, capacitor or inductor. In one embodiment, the integrated circuit may maintain the resistance, resistivity, capacitance, inductance, etc. of the component inside a narrow range in order to create a high-precision component regardless of changes in environmental changes such as temperature, pressure, humidity, etc.
申请公布号 WO0139252(A9) 申请公布日期 2002.09.26
申请号 WO2000US32198 申请日期 2000.11.22
申请人 THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS;NEBRIGIC, DRAGAN, DANILO;JEVTITCH, MILAN, MARCEL;HUANG, CHOW-CHI;KERR, KENDALL, WILLIAM 发明人 NEBRIGIC, DRAGAN, DANILO;JEVTITCH, MILAN, MARCEL;HUANG, CHOW-CHI;KERR, KENDALL, WILLIAM
分类号 H01L23/12;H01L23/50;H01L23/64;(IPC1-7):H01L23/66;H01L23/58 主分类号 H01L23/12
代理机构 代理人
主权项
地址