Method of embedding contact hole by damascene method

摘要

A carbon film is formed over an insulating film and a contact hole is defined therein by patterning. Copper is formed over an entire surface including the contact hole and polished by chemical mechanical polishing. The polishing of the copper is terminated with the carbon film as an etching stopper thereby to allow the copper to remain in the contact hole alone, whereby an embedded interconnection made up of the copper is formed by a damascene method.