| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a holding structure of a terminal which can alleviate a soldering stress due to heat acting on the soldered part and securely prevent generation of soldering cracks. SOLUTION: With the holding structure of the terminal 26 in which a soldered part 26b of the terminal 26 is held on a land part 23 of a board 21 by soldering, a pair of soldered parts 26b, 26b are formed by dividing the soldered part of the terminal 26. A connection hole each 21b, 21b is formed at a position opposing the pair of the soldered parts 26b, 26b of the board 21 and a pair of round- shaped terminal insertion holes 23a, 23a at a position opposing the pair of soldered parts 26b, 26b of the land part 23. Further, a constricted part each 23b is formed around the land part 23 between the pair of the terminal insertion holes 23a, 23a of the land part 23.</p> |
