发明名称 LEAD FRAME AND METHOD FOR CONNECTING LEAD TO SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a lead frame by which leads can efficiently be connected to both of the surfaces of a substrate. SOLUTION: A flat lead frame which consists of a frame part 10 and a first lead part 20 and a second lead part 30, both of which are shaped like combs, extends from this frame part 10 toward the inner peripheral side of it, so that their tip parts face each other, sites of the frame 10 except for sites supporting both of the parts 20 and 30 and the tip parts of both of the parts 20 and 30 are folded in a direction crossing with the main surface of the lead frame and an interval W between a folded part 21 of the part 20, and a folded part 31 of the part 30 is made to be nearly equal in thickness to that of the substrate.
申请公布号 JP2002270750(A) 申请公布日期 2002.09.20
申请号 JP20010067001 申请日期 2001.03.09
申请人 DENSO CORP 发明人 NIIMI AKIHIRO
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
代理机构 代理人
主权项
地址