| 摘要 |
PROBLEM TO BE SOLVED: To provide a cap IC socket which is capable of coping with many kinds of IC packages by exchanging only a pressurizing body to pressurize an IC package mounted on the cap, and in which this exchange is made facilitat ed, the exchange of the pressurizing part is possible even in a state that it is mounted on a test board and the efficiency of the exchange is superior. SOLUTION: In the cap IC socket having a substrate and the cap rotatably hinge-joined to the substrate via a shaft, the cap includes the pressurizing body to pressurize the IC package, and makes the pressurizing body exchangeable against the cap.
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