| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for circuit parts which can form a smooth plated face with good workability. SOLUTION: A molding part 1 is formed by molding a synthetic resin material into a prescribed outer shape. The surface of the circuit molding face of the molding part is wet-blasted to perform substrate treatment. A plated catalyst is given to the circuit molding face which is substrate-treated, and the plated catalyst is activated. Parts being conductive parts 2a and 2b are electrolessly plated an electroless plating part is electrolytically plated. Thus, conductive parts 2a and 2b are formed on the circuit molding face.
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