| 摘要 |
PROBLEM TO BE SOLVED: To realize stacking of upper and lower substrates in a stable condition, without a handling means coming into contact with pattern formation surfaces of the upper and lower substrates. SOLUTION: A lower substrate 1 is fed into a stacking stage SS by a lower substrate transfer means 10, while an upper substrate 2 is fed into the stacking stage by an upper substrate transfer means 11, respectively individually. The lower substrate 1 is fed into a lower substrate holding member 51 of the stage 50, with its pattern formation surface 1a being directed upward. The upper substrate 2, fed with its pattern formation surface 2a directed upward, is moved up by a substrate-lifting means 30 up to a substrate handling means 40, is reversed to direct the pattern formation surface 2a face downward, is transferred to an upper substrate-holding member 52 of the stacking means 50, and the upper holding member 52 is moved downward, to thereby form a stacked board 3. |
