| 摘要 |
PROBLEM TO BE SOLVED: To enable the insulating substrate of a thermistor device composed of the substrate and a thermistor layer of thermistor material formed on the substrate to be more improved in mechanical strength. SOLUTION: A thermistor device 10 is equipped with an insulating substrate 11 of alumina, a thermistor layer 12 of thermistor material formed on the substrate 11, and electrodes 13 electrically connected to the thermistor layer 12 where the substrate 11 is at least covered with an electric insulating member 14 of SiO<2> or the like having a smaller linear expansion coefficient than alumina.
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