发明名称 |
ELECTRONIC CIRCUIT DEVICE HAVING MULTIPLE WIRING BOARDS |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device of high density, which can reduce the rise of a temperature while the complication of constitution and work is suppressed. SOLUTION: A base plate 4 has columns 42 and 43 erected perpendicularly to a main face from the main face of the main plate 41 of the base plate 4. The step faces 421 and 431 of the columns 42 and 43 support a printed circuit board 1. The top faces 422 and 423 of the columns 42 and 43 projected from the opening of the printed circuit board 1 support a printed circuit board 2.
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申请公布号 |
JP2002271058(A) |
申请公布日期 |
2002.09.20 |
申请号 |
JP20010067264 |
申请日期 |
2001.03.09 |
申请人 |
DENSO CORP |
发明人 |
OYAMA YOSHIHIKO;YAMASHITA TAKESHI;HATAKEYAMA MASAYA |
分类号 |
H05K7/14;(IPC1-7):H05K7/14 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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