| 摘要 |
PROBLEM TO BE SOLVED: To provide an equipment and method of soldering a circuit board which can prevent generation of defects without using lead-containing solder. SOLUTION: The circuit board 60 which reflowed in a reflow furnace 10 is transferred to a wave soldering bath 20. The circuit board 60 transferred to the wave soldering bath 20 is soldered with a solder wave. When soldering the circuit board 60 in the wave soldering bath 20, air is blown against the circuit board 60 from a nozzle 41 disposed above, thereby cooling the surface of the circuit board 60 on the opposite side to the wave soldering bath. By cooling the circuit board 60, the remelting of the reflowed solder is prevented, and generation of defects due to remelted of solder is prevented. Since there is no need of lowering the melting point of the molten solder in the wave soldering bath 20, soldering can be carried out without using lead-containing solder.
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