| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer, with which the problems associated with thermal stress reduction can be solved, more specifically, an interposer for conductive connection that is applicable to bare chip mounting, which requires low cost and is highly reliable. SOLUTION: The interposer is constituted of an insulation film and a conductive pattern and is provided with a flat electrical conduction path, formed on one side of the insulating film and a projected electrical conduction path, going beyond the other side of the insulating film or coming into contact with the other side.
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