PROCEDE POUR L'OBTENTION D'UN MODULE INCLUANT UN BOBINAGE INDUCTIF ET MODULE CORRESPONDANT

摘要

The coil is formed from successive printed circuit layers, joined by edges where circuits are cut. The process for mfr. of a module containing an inductive winding includes formation of a stack of printed circuit film elements (3A-3N). a molding is then formed around the assembly of film elements in order to form a rigid block. The block is cut at least once laterally along the stack, in order to reveal the conductive tracks which all terminate at a common level under the cut. A further step includes the formation of connections on the surfaces of the block to provide selective interconnection between the conductive tracks, and to allow their connection to external terminals. An aperture through the stack of printed circuit film elements (6) allows for the insertion of a magnetic core within the module.