| 发明名称 |
Electronic device and method of manufacture the same |
| 摘要 |
An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.
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| 申请公布号 |
US2002130402(A1) |
申请公布日期 |
2002.09.19 |
| 申请号 |
US20010940537 |
申请日期 |
2001.08.29 |
| 申请人 |
HITACHI, LTD. |
发明人 |
USAMI MITSUO |
| 分类号 |
B42D15/10;G06K7/00;G06K19/04;G06K19/07;G06K19/077;H01L21/50;H01L23/051;H01L23/08;H01L23/29;H01L23/31;H01L23/48;H01L23/552;H01L23/64;(IPC1-7):H01L23/02 |
主分类号 |
B42D15/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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