发明名称 |
Ultra low-k dielectric materials |
摘要 |
The invention relates to a dielectric composition and a process for forming an integrated circuit using the composition. The dielectric composition comprises a polymer precursor that upon heating to a cure temperature cross-links to form an organic polysilica layer and a sufficient amount of porogen that the layer has a porosity of from about 5% to about 80%. The porogen is non-reactive with the polymer precursor. Upon heating to a decomposition temperature, the porogen decomposes to form a gas that diffuses out of the layer.
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申请公布号 |
US2002132496(A1) |
申请公布日期 |
2002.09.19 |
申请号 |
US20020071134 |
申请日期 |
2002.02.08 |
申请人 |
BALL IAN J.;JANG QIN;SHI YUWEN |
发明人 |
BALL IAN J.;JANG QIN;SHI YUWEN |
分类号 |
H01L21/312;H01L21/316;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/312 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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