| 摘要 |
A component for fabricating microelectronic assemblies has numerous curved leads (24a, 24b) on a surface. Each lead has an anchor end (26) fixed to the body of the component, a tip end (28) which can be bonded to a contact on a mating component and lifted away from the component body, and an elongated main portion (27) which is bent away from the component body in the lifting action. The anchor end (26) of each lead is nested within the curved portion (27) of another lead, so as to provide an extraordinarily compact arrangement suitable for use with components having closely spaced contacts as, for example, a semiconductor chip or wafer having contact pitch less than 500 microns. The leads (24a, 24b) may be disposed in pairs (36), with the anchor end of each lead encompassed by the main portion of the other lead in the same pair. |
