| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a thermal head in which the height of a wire projecting in loop from the upper surface of a head substrate arranged with a heater can be lowered at the time of wire bonding. SOLUTION: In the method for manufacturing a thermal head where a head substrate 2a arranged with a heater 3 and a circuit substrate 6a are secured onto a supporting plate 1 and a drive element 4 is mounted on the circuit substrate, an auxiliary plate 8 secured to the circuit substrate and a temporarily stopped spacer 9 are interposed between the circuit substrate and the supporting board. After the head substrate and the drive element are connected electrically through a wire, the spacer is removed and the circuit substrate is moved downward thus lowering the height of the wire 5 on the head substrate side projecting from the upper surface of the head substrate.
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