| 摘要 |
<p>This invention provides an electro-magnetic relay formed on a substrate (1), preferably a multi-layer printed circuit board. The magnetic circuit (4, 5, 6a, 6b, 7a, 7b) passes through holes (2, 3) in the substrate, and is formed using printed circuit manufacturing techniques, such as electroplating to manufacture the plated through holes. The armature 7b is formed by depositing the armature material on a temporary layer, which is then removed.</p> |
