| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor measuring instrument which can accurately measure the height of a bump even when the bump deforms and then does not have the peak in its center. SOLUTION: The peak position of the spherical bump 21 is lit up with perpendicular light from a 1st lighting device 51 and detected by a 1st image pickup means 52 and further the bump peak position is lit up with light obliquely from above by a 2nd lighting device 62; and an image processing part 7 measures the height of the bump peak from the two bump peak positions by a stereogram method.
|
