STACKING STRUCTURE OF SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A stacking structure of semiconductor chips is provided to prevent a damage and to reduce the thickness of the chip. CONSTITUTION: A stacking structure of semiconductor chips comprises a substrate(7) formed with a number of circuit patterns, a first semiconductor chip(1) having a first(1a) and a second(1b) surfaces and a multiple of input/out pads(1c), a spacer(3) fixed on the second surface(1b) of the first semiconductor chip(1) and a second semiconductor chip(2) having a first(2a) and a second(2b) surfaces and a multiple of input/output pads(2c). At this point, the second semiconductor chip(2) is fixed with the spacer(3) through an insulating part on the first surface(2a).