发明名称 |
METHOD FOR MANUFACTURING SOLID STATE IMAGE PICK UP DEVICE |
摘要 |
PURPOSE: A method for manufacturing solid state image pick up device is provided to improve a gathering efficiency by implanting gathering dopants. CONSTITUTION: A fabrication method of a solid state image pick up device comprises a first step for supplying a semiconductor substrate(10) for forming the solid state image pick up device on a first surface(10a) having the first surface(10a) and a second surface(10b) confronted with the first surface(10a), a second step for forming a polysilicon layer(12) including gathering dopants having a first density on the second surface(10b) of the semiconductor substrate(10) and the last step for condensing the gathering dopants having a first density into the remaining polysilicon layer(12) after decreasing the thickness of the polysilicon layer(12) including the gathering dopants.
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申请公布号 |
KR20020072372(A) |
申请公布日期 |
2002.09.14 |
申请号 |
KR20010012249 |
申请日期 |
2001.03.09 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI, JAE HEON;JUNG, SANG IL;LEE, JUN TAEK;PARK, SANG SIK;TAKAGI MIKIO |
分类号 |
H01L21/322;H01L27/146;H01L31/10;(IPC1-7):H01L27/148 |
主分类号 |
H01L21/322 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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