发明名称 METHOD FOR MANUFACTURING SOLID STATE IMAGE PICK UP DEVICE
摘要 PURPOSE: A method for manufacturing solid state image pick up device is provided to improve a gathering efficiency by implanting gathering dopants. CONSTITUTION: A fabrication method of a solid state image pick up device comprises a first step for supplying a semiconductor substrate(10) for forming the solid state image pick up device on a first surface(10a) having the first surface(10a) and a second surface(10b) confronted with the first surface(10a), a second step for forming a polysilicon layer(12) including gathering dopants having a first density on the second surface(10b) of the semiconductor substrate(10) and the last step for condensing the gathering dopants having a first density into the remaining polysilicon layer(12) after decreasing the thickness of the polysilicon layer(12) including the gathering dopants.
申请公布号 KR20020072372(A) 申请公布日期 2002.09.14
申请号 KR20010012249 申请日期 2001.03.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, JAE HEON;JUNG, SANG IL;LEE, JUN TAEK;PARK, SANG SIK;TAKAGI MIKIO
分类号 H01L21/322;H01L27/146;H01L31/10;(IPC1-7):H01L27/148 主分类号 H01L21/322
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