发明名称 INTERLEAVED WORDLINE ARCHITECTURE
摘要 A high-density folded bitline memory array architecture is disclosed. Hi gh memory cell packing density is achieved by dividing polysilicon wordlines in to short individual segments in the folded bitline scheme. Each wordline segment form s the gate of one or two DRAM memory cell transistors, and each segment is connected to a metal wordline, or conductor having low resistivity. By eliminating spaces between the memory cells due to passing wordlines, a cell arrangement and density similar to op en bitline schemes is achieved. Further packing is obtained by arranging two columns of memory cells parallel to each bitline, each column offset with the other by a predetermined pitch. Therefore, by increasing the number of memory cells connected to each complementary bitline pair, each bitline pair can be cut in half and connected to its own bitline sense amplifier to reduce the bitline capacitance. Hence the memory cell architecture of the present invention occupies less area, and operates with faster speed than memory cell architectures of the prior art.
申请公布号 CA2369846(A1) 申请公布日期 2002.09.14
申请号 CA20022369846 申请日期 2002.01.31
申请人 ATMOS CORPORATION 发明人 KURJANOWICZ, WLODEK;KWOK, DAVID CHI WING
分类号 G11C8/14;G11C11/4097;H01L21/8242;H01L27/02;(IPC1-7):G11C5/06;G11C11/409 主分类号 G11C8/14
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