发明名称 |
Conductive paste and laminated ceramic electronic component using the same |
摘要 |
A laminated ceramic electronic component, such as a laminated ceramic capacitor, having superior heat shock resistance and humidity loading resistance is provided, in which no delamination occurs during a firing step. A conductive paste advantageously used for forming internal electrodes and a laminated ceramic electronic component using the conductive paste are provided. The conductive paste is a conductive powder primarily composed of Ni; an organic vehicle; a compound A which is at least one of an organic acid metal salt, an organic metal complex salt and an alkoxide, and which contains at least one of Mg, Ca and Ba; and a hydrolyzed compound B containing at least one of Al and Si; wherein the hydrolyzed compound B is adhered to the surface of the conductive powder.
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申请公布号 |
US2002124910(A1) |
申请公布日期 |
2002.09.12 |
申请号 |
US20010893174 |
申请日期 |
2001.06.27 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
MIYAZAKI TAKAHARU;YAMANA TSUYOSHI |
分类号 |
H01G4/12;H01B1/22;H01G4/008;H01G4/30;H05K1/09;(IPC1-7):B23K35/34 |
主分类号 |
H01G4/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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