AUTOMATIC CONTINUE WAFER PROCESSING SYSTEM AND METHOF FOR USING THE SAME

摘要

An automatic continuous wafer processing system includes at leat two polygon module units including a polygon main body where two first polygon paths through which a wafer passes is formed at side thereof, a plurality of process modules that are coupled with two other surfaces, excluding the surface on which the first polygon path is formed, of the polygon main body by in clusters of two modules, and a polygon fixed robot fixed in the polygon main body to transfer the wafer to the process modules; a wafer distribution tower including a tower main body where distribution paths are formed in the same number of the polygon module units, an aligner to recognize a degree of misalignment of the wafer, and an elevating robot to be capable of moving up and down to take wafer drom the aligner and move the wafer up and down to a position corresponding to each of the distribution paths; and load lock units, each of which is installed between the polygon module units and the wafer distribution lower, the load lock units for temporarily storing the wafer, which passes through the first polygon paths and the distribution paths.