发明名称 Heat-dissipating assembly
摘要 A heat-dissipating assembly includes a plurality of heat-dissipating devices, each of which includes a frame having at least one locating window for allowing the heat-dissipating device to inhale air and discharge airflow, and a stream-guiding wall formed beside the locating window; and at least one blade structure mounted in the locating window of the frame. In addition, each heat-dissipating device further includes at least one engaging medium to be engaged with a corresponding engaging medium of another heat-dissipating device, thereby allowing the plurality of heat-dissipating devices to be combined in parallel, side by side, or in tiers.
申请公布号 US2002127099(A1) 申请公布日期 2002.09.12
申请号 US20020125539 申请日期 2002.04.19
申请人 DELTA ELECTRONICS INC. 发明人 HUANG WEN-SHI;LIN KUO-CHENG;LIN CHEN-CHANG
分类号 F04D25/16;H05K7/20;(IPC1-7):F01D1/02 主分类号 F04D25/16
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