METHOD FOR LOADING WAFER IN SEMICONDUCTOR FABRICATION PROCESS

摘要

PURPOSE: A method for loading a wafer in a semiconductor fabrication process is provided to enhance productivity by reducing a time for transferring a wafer. CONSTITUTION: A wafer cassette(130) is loaded in the second load lock chamber(114) adjacent to a process chamber(120). The second load lock chamber(114) is located at the nearest place from the load lock chamber(120). The wafer cassette is loaded in the third load lock chamber(116) and the first load lock chamber(112), sequentially. A wafer transfer process is performed by transferring the wafer of the wafer cassette loaded in the second load lock chamber(114). Accordingly, a processing time can be reduced by transferring the second load lock chamber(114) located at the nearest place from the load lock chamber(120).