| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of wrinkles in the periphery of a semiconductor chip of a release film when a chip exposing type resin mold package is to be manufactured by utilizing the release film. SOLUTION: The loseness of the release film 7 is absorbed by increasing a mold resin surface area by the projections 8 arranged to the undersurface of a floating block 5a in a lattice form so as to partition respective semiconductor chips 1 molded collectively from a resin to extend the looseness of the release film 7 and the generation of wrinkles in the peripheries of the semiconductor chips 1 at the time of mold clamping is prevented. Further, grooves are formed in the collective resin mold package by the projections 8 and the defectiveness of an outer shape due to the abrasion of a dicing blade is eliminated by forming a part of the package by the grooves at the time of dicing of the individual resin mold package and the cost reduction can be achieved by the reduction of a dicing sheet or the common use of a dicing fixture. |
