发明名称 CERAMIC COMPACT AND CERAMIC ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide a ceramic compact in which the content of an organic binder is low, and the heating and removal of the organic binder can be performed in a short time, and ceramic electronic parts using the ceramic compact. SOLUTION: The ceramic compact is produced by using ceramic slurry containing ceramic powder and an organic vehicle as an emulsion consisting of an organic binder consisting of a polyurethane resin and a solvent. When the ceramic slurry is produced by using a water-containing solvent, as the organic binder, an anionic polyurethane resin, or a nonionic polyurethane resin, or an anionic/nonionic polyurethane resin is used.
申请公布号 JP2002255655(A) 申请公布日期 2002.09.11
申请号 JP20010219964 申请日期 2001.07.19
申请人 MURATA MFG CO LTD 发明人 HIRANO ATSUSHI;YOKOYAMA TOMOYA
分类号 C04B35/622;B28B1/30;C04B35/00;C04B35/495;C04B35/632;H01G4/12 主分类号 C04B35/622
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