发明名称 ELECTROLESS PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To control a figuration in a nano-order region in forming a metal film. SOLUTION: A method for forming a metal film having a micro protruded structure on the surface of a substance to be treated by electroless plating, comprises a pretreatment process of immersing the substance in an aqueous solution of palladium dichloride and washing it with water, after immersing the substance in an aqueous solution of tin dichloride and washing it with water, and an electroless plating process by immersing the substance in a plating solution containing nickel salt and cation generated by hydration of additives. In the pretreatment process, when concentration of the aqueous solution of tin dichloride is to be C1 and concentration of the aqueous solution of palladium dichloride is to be C2 , C1 /C2 namely a ratio of C1 and C2 , is in a range of 0.2 or more and 200 or less, and in the plating process, concentration of the cation generated by hydration of the additives in the plating solution is in a range of 1.0×10<-5> ppm or more and 1.0 ppm or less.
申请公布号 JP2002256441(A) 申请公布日期 2002.09.11
申请号 JP20010058309 申请日期 2001.03.02
申请人 KANAGAWA ACAD OF SCI & TECHNOL;JAPAN SOCIETY FOR THE PROMOTION OF SCIENCE 发明人 MONOBE HIDEJI;OTSU GENICHI
分类号 C23C18/18;C23C18/31;G01Q60/22;G02B6/02;G02B6/10;(IPC1-7):C23C18/18;G01N13/14 主分类号 C23C18/18
代理机构 代理人
主权项
地址