| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card, which quickly follows a temperature rise and a temperature drop, in which the defect of contact is not generated, when the terminal of the probe card is displaced from a probe, in which an inspection device using the probe card does not form an wrong decision and which can miniaturize the inspection device. SOLUTION: The probe card is used to inspect an integrated circuit formed on a semiconductor wafer. The probe card is composed of a ceramic substrate made of a non-oxidative ceramic, and the thickness of the ceramic substrate is 50 mm or less.
|
