发明名称 DEVICE AND METHOD FOR TESTING SOLDERABILITY
摘要 PROBLEM TO BE SOLVED: To substantially prevent a phenomenon that a flux is wetted up on a sample holding member to raise a disturbance in a wet waveform, and measure a sure wetting time. SOLUTION: This solderablity testing device is provided with (A) a sample holding means 20 provided with the sample holding member 23 for holding a sample 50, (B) an external force detecting means 10 for supporting the sample holding means 20, (C) a solder paste storage container 30 stored with a solder paste 31 containing the flux, and (D) a heating means 40 for heating the solder paste 31. A flux wetting preventing layer is formed at least on a surface of a sample holding portion 23A of the sample holding member 23.
申请公布号 JP2002257701(A) 申请公布日期 2002.09.11
申请号 JP20010051611 申请日期 2001.02.27
申请人 SONY CORP 发明人 MASATOKI TAMIJI;SHINOZAKI YUTAKA
分类号 G01N13/00;B23K1/00;B23K3/00;B23K31/12;G01N3/06;G01N3/40;H05K3/34;(IPC1-7):G01N13/00 主分类号 G01N13/00
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