| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which, when cured, can develop excellent heat resistance, low hygroscopicity, and electrical properties and to provide a prepreg. SOLUTION: This composition essentially consists of an epoxy resin and a polyamide having repeating units represented by formula (A) (wherein m and n are integers satisfying the relationships: m>0, n>=0, 2<=m+n<=1,000, and 0.05<=m/(m+n)<=1; R1 to R4 are each hydrogen or a monovalent organic group; X is selected from specified structures; Y1 is at least one group selected from specified structures; and Y2 is a group selected from specified groups, provided that the sequence of repeating units may be random or block-wise).
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