| 摘要 |
In a polishing apparatus, a wafer is sustained by a wafer carrier and the wafer is ground with a polishing pad which is rotationally driven. A slurry is fed on to the polishing pad through a slurry feed nozzle. A filter is disposed upstream from the wafer in the direction of rotation of the polishing pad and traps the swarf generated on the polishing pad. A defense barrier is provided around the polishing pad to prevent the slurry on the polishing pad from spilling out therefrom during polishing and thus retains the slurry thereon, thereby recycling the slurry on the polishing pad. |
