Method of inspecting semiconductor chip with projecting electrodes for defects

摘要

A method of inspecting a semiconductor chip with projecting electrodes includes arranging, on a semiconductor chip having a peripheral edge with four corners, electrode terminals for detecting formation of projecting electrodes along the four corners of the peripheral edge of the semiconductor chip; measuring an electrical characteristic of each of the electrode terminals; and identifying the semiconductor chip as defective in terms of the projecting electrodes if the measured electrical characteristic does not conform to a desired characteristic.