发明名称 LASER BEAM MACHINING METHOD AND LASER BEAM MACHINING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining method and a laser beam machining device capable of making the quality of a machined hole uniform even in machining one piece of a printed board by a plurality of machining heads. SOLUTION: A lead for moving a machining head 7a is made to be 2A. And the lead of a screw 21 for moving a slide plate 20 mounted with a corner mirrors 30a, 30b is made to be A, and the twisting direction of the lead is made to be reverse to the lead of the screw 22. And the screw 21 and the screw 22 are connected by bevel gears 24a, 24b. When the machining head 7a is moved byΔL, the optical path of a passing beam 2a is made to be shorter byΔL, however, by moving a slide plate 20 byΔL/2, the optical path AE and the optical path FG are respectively made to be longer byΔL/2. Consequently, the both are offset so that the optical path Ka of the passing beam 2a and the optical path Kb of the reflection beam 2b can always be made equal.</p>
申请公布号 JP2002254191(A) 申请公布日期 2002.09.10
申请号 JP20010056943 申请日期 2001.03.01
申请人 HITACHI VIA MECHANICS LTD 发明人 WATANABE FUMIO;MICHIGAMI NORIO
分类号 B23K26/08;B23K26/06;B23K26/067;(IPC1-7):B23K26/08 主分类号 B23K26/08
代理机构 代理人
主权项
地址