| 摘要 |
<p>PROBLEM TO BE SOLVED: To make uniform the skin effect of a circuit electrode pattern formed on an electronic component mounting board and connected to electronic components, and, at the same time, to enable the board to cope with a superhigh-frequency circuit. SOLUTION: The electronic component mounting board 100 is provided with an insulating holding member 22, the circuit electrode pattern 13 held on the member 22, a semiconductor chip 11 mounted on the pattern 13, and terminal electrodes 15A and 15B connected to the chip 11. The pattern 13 is formed by selectively etching off a base material which can be plated and etched, after the base material is plated with conductive members by using nonplated members selectively formed on the base material as masks. When the pattern 13 is constituted in this way, such a circuit electrode pattern structure that the side edge of the circuit electrode pattern can be formed vertically with a prescribed thickness, as compared with a wiring pattern formed by etching copper foil can be adopted and the skin effect of the pattern 13 can be made uniform. Therefore, the high-frequency characteristic of the board 100 can be improved.</p> |
