发明名称 MULTILAYERED CHIP DIRECTIONAL COUPLER
摘要 PROBLEM TO BE SOLVED: To facilitate manufacture, and to reduce insertion loss by forming the length of a main signal line in an asymmetrical type shorter than the length of a coupling signal line. SOLUTION: The multiplayered chip directional coupler is composed of the first grounding pattern 117a formed on the top face of the first dielectric layer 101a, the coupling signal lines 105a and 105b formed by conductive patterns on the top faces of the second dielectric layers 101b, 101c laminated on the first dielectric layer 101a, the main signal line 103 which is formed on the top face of the third dielectric layer 101d laminated on the second dielectric layers 101b and 101c by a conductive pattern and has length shorter than the length of the coupling signal line 105b, the second grounding pattern 117b formed on the top face of the fourth dielectric layer 101e laminated on the third dielectric layer 101d and terminals formed on the side faces of the first or fourth dielectric layer and connecting the main signal line, the coupling signal lines, the first grounding pattern, and the second grounding pattern.
申请公布号 JP2002252508(A) 申请公布日期 2002.09.06
申请号 JP20010377359 申请日期 2001.12.11
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 SHIN JI HWAN;JEONG SEUNG GYO
分类号 H01P5/18;(IPC1-7):H01P5/18 主分类号 H01P5/18
代理机构 代理人
主权项
地址