发明名称 PRODUCT PACKAGING HAVING A NON-THERMOFORMED BLISTER-LIKE COMPARTMENT AND METHODS FOR MAKING SAME
摘要 A product package is described for enclosing an item in a non-thermoformed blister-like compartment. Also described are approaches for making the package. According to various aspects of the described package and manufacturing techniques, a blank (10) is cut out of a sheet of see-through plastic material (11), the blank having a plurality of panels (12, 14a-d) and flange sections (16) such that the blank can be formed, without thermoforming, into a blister-like compartment having a plurality of panels defining an enclosure with a mouth at its base and a flange at the mouth's perimeter. The blank may include printing, cutouts, perforations, or other features. The blank is then folded into a blister-like compartment and loaded with the item to be packaged. A backing (30) is positioned to enclose the loaded blister-like compartment and affixed to the flange.
申请公布号 WO0226569(A3) 申请公布日期 2002.09.06
申请号 WO2001US27730 申请日期 2001.09.25
申请人 IMPAC GROUP, INC.;MAZUREK, RICHARD 发明人 MAZUREK, RICHARD
分类号 B65D5/32;B65D5/42;B65D5/54 主分类号 B65D5/32
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