发明名称 METHOD FOR DETECTING COPPER DEPOSITED SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS USING THE SAME
摘要 PROBLEM TO BE SOLVED: To detect deposition of copper on a substrate relatively simply based on the specificity of a spectral reflectance on the copper deposited substrate. SOLUTION: This method for detecting copper deposition on the processed surface of the substrate comprises a data measurement process (steps S2 to S4) for measuring the spectral reflectance data on the processed surface of the substrate and a discrimination process (step S5) for discriminating, based on the specificity of the spectral reflectance data, if copper is deposited or not. Since the spectral reflectance data of the substrate to which copper is deposited shows the specificity, it is possible to discriminate if copper is deposited on the substrate based on if the measured spectral reflectance data shows the specificity or not.
申请公布号 JP2002252262(A) 申请公布日期 2002.09.06
申请号 JP20010048317 申请日期 2001.02.23
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 KONDO NORIYUKI
分类号 H01L21/66;H01L21/304;(IPC1-7):H01L21/66 主分类号 H01L21/66
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