摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic circuit board by which an increase in manufacturing costs and an increase in complexity of a manufacturing process can be suppressed while preventing the mixing of different types of electronic circuit boards and an erroneous assembly and to provide its manufacturing method and a tape cassette. SOLUTION: An indication part 30 which is provided with previously formed several different indications 31 and 32 is formed on the surface of a substrate. Coverings (solder) 31C and 32C for covering only specified indications are formed at the same time of the forming of solder patterns for mounting a chip resistor 29. Since the process is performed by a screen printing method by using a sheet of screen mask, the need for separately providing a printing process step for indicating the type of substrate is eliminated. Accordingly, the productivity is improved and the manufacturing costs are reduced.</p> |