发明名称 ELECTRONIC CIRCUIT BOARD, METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT BOARD AND TAPE CASSETTE
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic circuit board by which an increase in manufacturing costs and an increase in complexity of a manufacturing process can be suppressed while preventing the mixing of different types of electronic circuit boards and an erroneous assembly and to provide its manufacturing method and a tape cassette. SOLUTION: An indication part 30 which is provided with previously formed several different indications 31 and 32 is formed on the surface of a substrate. Coverings (solder) 31C and 32C for covering only specified indications are formed at the same time of the forming of solder patterns for mounting a chip resistor 29. Since the process is performed by a screen printing method by using a sheet of screen mask, the need for separately providing a printing process step for indicating the type of substrate is eliminated. Accordingly, the productivity is improved and the manufacturing costs are reduced.</p>
申请公布号 JP2002252435(A) 申请公布日期 2002.09.06
申请号 JP20010215257 申请日期 2001.07.16
申请人 SONY CORP 发明人 KONDO SHINICHI
分类号 G11B23/28;H05K1/02;H05K3/00;H05K3/06;H05K3/34;(IPC1-7):H05K1/02 主分类号 G11B23/28
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