METHOD OF FORMING A THIN WAX LAYER ON A MOUNTING BLOCK FOR MOUNTING A SEMICONDUCTOR WAFER

摘要

A method of the invention is directed to forming thin layers of wax on surfaces of mounting blocks (10) for mounting semiconductor wafers on the mounting blocks so that each wax layer (18) has a desired wax layer shape and thickness selected to facilitate shaping of each wafer during subsequent polishing of the wafer. The method includes selecting values of at least some variables having an effect on the shape and thickness of the wax layer .The way layer is modelled numerically multiple times while changing at least one of the values to determine values for the desired wax layer shape and thickness. Wax layers are formed on the surfaces of the mounting blocks by using the determined values of the variables to achieve the desired wax layer shape and thickness for producing a consistent, desired shape of the wafer after polishing.