| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric conversion module which does not generate peeling in a junction part between a silicon nitride insulation substrate and an electrode. SOLUTION: In the thermoelectric conversion module wherein P-type and N-type thermo-electric conversion elements are connected in series via an electrode jointed on the insulation substrate, the insulation substrate is composed of a sintered body of silicon nitride. A region of the insulation substrate jointed to at least an electrode has a surface whose sintered texture is removed, and a center line average roughness Ra of the surface, whose sintered texture is has been removed, is 0.01 to 0.6 μm. |
