| 摘要 |
PROBLEM TO BE SOLVED: To provide a stable photosensitive resin composition capable of retaining the tack-freeness of a photosensitive resin dry film in warming by the effects of remaining heat after drying, a temperature rise due to exposure, etc., capable of undergoing contact exposure through a mask pattern and having high sensitivity, high adhesion and high resolution. SOLUTION: The photosensitive resin composition consists essentially of (A) a modified copolymer resin having a terminal ethylenically unsaturated group and a carboxyl group in a side chain and obtained by reacting a copolymer resin having carboxyl groups with an alicyclic epoxy-containing unsaturated compound, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule and (C) a photopolymerization initiator. |
