| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the weight and to lower the cost. SOLUTION: A radiation solid-state image pickup part 25 is composed of a base 31 provided in the front of a support base 24, a sensor substrate 33 which is provided in the front of the base 31, a fluorescent plate 34 provided in the front of the sensor substrate 33, and a metal film 36 provided in the front of the fluorescent plate 34, and the front of the sensor substrate 33 is a pixel area where photoelectric converting elements and TFT elements are formed. Circuit boards 42 and 43 connected to the sensor substrate 33 in order are equipped with ICs 45 and 46 respectively and the circuit boards 42 and 43 are provided with shield layers 51 and 52 which shield the ICs 45 and 46 so that radiation R will impinge on neither one. The shield layers 51 and 52 are made of organic or inorganic compounds obtained by powdering and mixing radiation-shield materials. The shield layer 51 is provided covering the top surface 45a and the entire flank 45c of the IC 45. The shield layer 52 is provided on the reverse surface 43b of the printed circuit board 43 and the shield layer 52 is as large as or larger than the IC 46.</p> |
