| 摘要 |
PROBLEM TO BE SOLVED: To solve problems one of which is a radiation of a laser driver in disposing so that a semiconductor laser is in proximity to a laser driver, and the others of which are those of an installation site of a heat insulating board and workability, because a printed wiring board of a flexible board is disposed on one face in the laser driver for electrically coupling. SOLUTION: The heat insulating board 3 is installed in a housing 1, and a side opposite to the connection face of the laser driver 4 connected to the flexible board 5 is installed so as to closely adhere onto the heat insulating board 3. Thus, the heat insulating board 3 is installed beneath the laser driver 4, and the flexible board 5 is disposed upward. In this state, the laser driver 4 is installed. |
